Investigation of Conductive Inks Based on Silver Nanoparticles for Flexible and Wearable Electronic Devices

Abstract

The Flexible and wearable electronic devices require conductive materials that combine high electrical performance with mechanical flexibility, stability, and compatibility with diverse substrates. Silver nanoparticle–based conductive inks have emerged as leading candidates due to their exceptional conductivity, tunable particle size, and suitability for low-temperature processing. This study investigates the synthesis, formulation, printing behavior, and performance characteristics of silver nanoparticle conductive inks intended for flexible and wearable applications. The research evaluates the influence of nanoparticle morphology, capping agents, dispersant concentration, and solvent composition on rheology, film formation, and conductivity. Multiple printing techniques, including inkjet printing and screen printing, are analyzed to determine their effect on pattern fidelity and electrical performance. Post-printing sintering processes—thermal, photonic, and chemical—are examined to understand their impact on nanoparticle coalescence and substrate compatibility. Mechanical durability is assessed through bending and cyclic deformation tests, while environmental stability is evaluated under temperature and humidity variations. Results demonstrate that properly engineered silver nanoparticle inks, combined with optimized sintering techniques, achieve low resistivity, strong adhesion, and long-term flexibility suited for wearable sensors, smart textiles, and stretchable circuits. The study provides comprehensive insights into processing– structure–property relationships essential for advancing next generation flexible electronics.